製程能力 | 瀚宇博德股份有限公司

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roduct Information

產品資訊

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製程能力 HSB Capability

Summary

Parameter		Normal-MP	Advanced-MP	Limited production
Layer Count		2 - 20 Layers	26 Layers	34 Layers
Thickness		0.6 – 3.5mm	0.6 – 3.5mm
Material	FR-4	Mid. Tg/ HiTg/ HF	Ultra low loss	Rogers & hybrid material
Material	Min Core	4mil	3mil	2.5mil
Copper	Internal	½oz, 1oz, 2oz	3oz	4oz
Copper	External	½oz, 1oz	2oz	3oz
Max Shipping Size		19.5”*22.5” (495 mm x 571 mm)	19.9” x 23.5” (506 mm x 598 mm)	19.9”*24.45  (506 mm x 621 mm)
Max Shipping Size		PTH/ VIPPO PTH/Sequential/ 1 level HDI/ Skip via		19.9”*24.45  (506 mm x 621 mm)

Trace Width/Space

Parameter		Copper thickness	Normal-MP	Advanced-MP	Limited production
Min Trace Width/Space	I/L	½oz	3.5/3.5mil	3/3mil	2.5/2.5
		1oz	3.5/3.5mil	3/3mil	2.5/3
		2oz	6/6mil	5/5mil	4.5/5
		3oz	10/10mil	8/8mil
	O/L	½oz + plating	3.5/3.5mil	3/3mil	2.5/3
		½oz + plating (VIPPO)	4/4mil	3.5/3.5mil	3/3.5
		1oz + plating	6/6mil	5/5mil
		2oz + plating	8/10mil	6/8mil

Drilling

Parameter		Normal-MP	Advanced-MP	Limited production
Layer Count	Min FHS (a)	8mil	6mil / 4mil	Skip via (10 mil)
	Min DHS (d)*	9.8mil	7.9 mil / 6mil	Skip via (12 mil)
	Min Ring (b)	d+10mil	d+8mil	d+6mil
	Min AntiPad (c)	d+20mil	d+18mil	d+16mil
Material	Min FHS	4	4
Material	Min Ring	D+8	D+6
Copper	Min FHS	10
Copper	Min Ring	d+10
Max Shipping Size	BDHS (e)	d+8mil	d+6mil(CCD)
	Stub Length (g)	7±5mil	6±4mil	5±3mil
	Accuracy (f)	±4mil	±3mil(CCD)
	Back Drill Clearance (h)	d+20mil	d+18mil(CCD)	d+16mil (Vacuum plugging)

Plating Aspect Ratio

Parameter		Normal-MP	Advanced-MP	Limited production
PTH	Max A/R (Board thickness/ Min finish hole size)	10.5 (63 mil /6 mil) 12.5 (100 mil / 8 mil) 12.5 (125 mil/10 mil) 10 (260 mil/26 mil)	10.5 (63 mil /6 mil) 12.5 (100 mil / 8 mil) 12.5 (125 mil/10 mil) 10 (260 mil/26 mil)	16.7 (100 mil/ 6 mil) 20 (160 mil/ 8 mil) 20 (200 mil/10 mil) 16 (260 mil /16 mil)
Micro & Skip Via	Max A/R (Board thickness/ Min finish hole size)	0.75 (3mil/4mil) & (7.5mil/10 mil)	0.8 (3.2mil/4mil) & (8mil/10 mil)

Aspect ratio	16.7
Board thickness	100mil
FHS	6mil
DHS	7.9mil

Aspect ratio	15
Board thickness	120mil
FHS	6mil
DHS	7.9mil

Aspect ratio	16.7
Board thickness	100mil
FHS	6mil
DHS	7.9mil

Soldermask / Legend

Parameter		Normal-MP	Advanced-MP
Soldermask	Color	Green / Blue Red / Yellow / Black	Low DK SM
	Min. Dam	3mil / 4mil(Black)	2.5mil
	Min. Clearance	2mil	1.5 mil
	Min. Coverage	2.5mil	2mil
Legend	Color	White / Yellow	Black
Legend	Min. Width	5mil	4mil / 6mil(Black)

Surface Finish

Parameter		Normal-MP
Soldermask	OSP	✓ (In-House)
	Gold Plating	✓ (In-House)
	ENIG	✓
	IMAg	✓
	HASL	✓
	Selective ENIG	✓
	IMSn	✓
	LF HASL	✓

Tolerance

Parameter		Normal-MP	Advanced-MP	Limited production
Registration	Core	2.5mil	2mil	1.5mil
Registration	D2M	5mil	4.5mil	4mil
Tolerance	Impedance	±10%	Inner layer + 8% Outer layer + 10%	Inner layer + 7% Outer layer + 10%
	Dimension	Routing：±8mil	Routing：±5mil
	Dimension	V-Cut：±10mil
	Thickness	±10%	±8% (1.6mm↑)
	PTH	±3%	±2mil
	NPTH	±2%	±2mil

Conventional Capability Summary

Parameter		2020		2021
Parameter		MP	Sample	2021
Max. Layer count		16 L	18-22 L	24-28 L
Board thick.		0.4~3.0mm	3.0~3.3mm	3.2~4.0mm
Material	FR-4	Std-Loss、Mid- Loss、Low loss:(Mid. Tg/Hi.Tg/HF)	Std-Loss、Mid- Loss、Low loss、Very low loss：(Mid. Tg/Hi.Tg/HF)	Ultra low-loss
Material	Min Core	75um	63.5um	63.5um
copper	Inner	½oz, 1oz , 2oz，3oz	½oz, 1oz , 2oz, 4oz	5oz
copper	Outer	½oz, 1oz, 2oz	½oz, 1oz, 2oz, 3oz	4oz
Max Shipping Size		16”*19.2” (406 mm x 483 mm)	16x 21” (406mm x 533 mm)	16x 24.45” (406mm x 621 mm)

Parameter			2020		2021
Parameter			MP	Sample	2021
Trace/Space	I/L	½oz	75/75um	63.5/75um	63.5/63.5um
		1oz	75/89um	63.5/75um	63.5/75um
		2oz	100/150um	75/127um	75/127um
		3oz	200/250um	200/250um	150/200um
	O/L	½oz + plating	75/75um	63.5/75um	63.5/75um
		1oz + plating	100/150um	75/127um	75/127um
		2oz + plating	250/250um	200/250um	200/200um
		3oz + plating	300/300um	300/300um	250/250um

Parameter		2020		2021
Parameter		MP	Sample	2021
Drill(PTH)	Min FHS (a)	200um	150um	150um
	Min DHS(d)	250um	200um	200um
	Min Ring (b)	d+250um	d+200um	d+200um
	Min AntiPad (c)	d+400um	d+380um	d+380um
	Max A/R of FHS (t/a)	10:1	12:1	12:1
	Max A/R of DHS (t/d)	8:1	10:1	12:1
Back Drill	BDHS (e)	d+200um	d+150um(CCD)	d+150um(CCD)
	Stub Length (g)	178±125um	150±100um	125±75um
	Accuracy (f)	±100um	±75um(CCD)	±75um(CCD)
	Back Drill Clearance (h)	d+500um	D+460um(CCD)	d+356um (Vacuum plugging)
	Min Back Drill Pitch	760um	700um	660um

Parameter		2020		2021
Parameter		MP	Sample	2021
Solder mask	Color	Green / Blue Red / Yellow / Black	Custom	Custom
	Min. dam	75um/100um(Black)	63.5um/ 75um (Black)	63.5um/ 75um (Black)
	Min. Clearance	50um	37.5um	37.5um
	Min. Coverage	56um/69um(Black)	50um/63.5um(Black)	50um/63.5um(Black)
	Thickness (On the circuit)	10um～36um	7.5um～28um	7.5um～28um
Legend	Color	White / Yellow / Black	Custom	Custom
Legend	Min. Width	100/150um(Black)	100/ 127um(Black)	100/ 127um(Black)
Tolerance	Impedance	≧50ohm，10%； ≦50ohm，+/-5ohm	≧50ohm，8%； ≦50ohm，+/-5ohm	≧50ohm，8%； ≦50ohm，+/-4ohm
	Thickness	±10%	8%	8%
	Dimension	Routing：±127um	Routing：±100um	Routing：±100um
	Dimension	V-Cut：±127um	V-Cut：±127um	V-Cut：±127um
	PTH	±75um	±50um	±50um
	NPTH	±50um	±37.5um	±50um

Capability / Stack up

Stack up
1 + N + 1		MP	4+N+4		MP
2 + N + 2		MP	5+N+5		Sample
3+N+3		MP	Anylayer		Sample

HDI Capability Summary

Parameter	2020		2021	2022~2023
Parameter	MP	Sample	2021	2022~2023
PWB Build-Up	3-N-3,4-N-4	Any-layer	Any-layer	Any-layer
Max. Layer count	14 L	16 L	16 L	18 L
Min. Dielectric Thick (um)	40	35	35	30
Min. Core Thick (um)	50	50	40	40
Min. Cu thickness outer layer (um)	30	25	20	20
Min. Cu thickness inner layer (um)	18	15	15	12
Min Board Thick(um)	300	300	300	300
Min Board Thick for 10L any-layer (um)	700	600	550	550
Solder Mask Registration(um)	44.5	37.5	30	25
Solder Mask Web Width(um)	75	63.5	50	50
Solder Mask thickness (um)	20	17.5	17.5	15

Parameter		Ref.	2020	2021	2022-2023
Outer layer	μVia BGA Pad	P	250um	200um	180um
	Laser Drill Diameter	D	100um	75um	63.5um
	Trace Width	T	65um (25um Cu )	50um (20um Cu )	44.5um (20um Cu )
	Trace Space	S	65um (25um Cu )	50um (20um Cu )	44.5um (20um Cu )
	Pad To Trace	PtT	65um	50um	50um

Parameter		Ref.	2020	2021	2022-2023
Inner layer & Sub-Outer layer	μvia Pad Diameter	P	225um	200um	180um
	Laser Drill Diameter	D	100um	75um	63.5um
	Trace Width	T	50um (20um Cu )	50um (20um Cu )	44.45um (20um Cu )
	Space Width	S	50um (20um Cu )	50um (20um Cu )	44.45um (20um Cu )
	Trace to Pad Space Width	TtP	50um	50um	44.45um

Parameter		Ref.	2020	2021	2022-2023
Through Hole	Drill	B	200um	150um	150um
	Drill Pad	A	450um	350um	350um
	Anti Pad	G	560um	450um	450um
	Drill-Cu	D	180um	150um	150um

Surface Finished Capability

Parameter	MP
OSP
IMAg
ENIG
Selective ENIG
HASL
HF HASL
IMSn
Gold Plating
Carbon Ink

Anylayer stackup

Cross-section

Reliability

Item	Condition	Specification	Result
IST	Precondition 260℃,6cycles Thermal cycle150℃ Min200cycle	Customer spec. No delamination No crack issue Resistance deviation < 10%	Pass
HCT	Voltage 10 v, the temperature up to 180 ℃, duration more than 300 sec	Customer spec. No delamination No crack issue Resistance deviation < 10%	Pass