Process Capability
Guanyin Factory
Jiangyin Factory
Summary
| Parameter | Normal-MP | Advanced-MP | Limited production | |
|---|---|---|---|---|
| Layer Count | 2 - 20 Layers | 26 Layers | 34 Layers | |
| Thickness | 0.6 – 3.5mm | 0.6 – 3.5mm | ||
| Material | FR-4 | Mid. Tg/ HiTg/ HF | Ultra low loss | Rogers & hybrid material |
| Min Core | 4mil | 3mil | 2.5mil | |
| Copper | Internal | ½oz, 1oz, 2oz | 3oz | 4oz |
| External | ½oz, 1oz | 2oz | 3oz | |
| Max Shipping Size | 19.5”*22.5” (495 mm x 571 mm) | 19.9” x 23.5” (506 mm x 598 mm) | 19.9”*24.45 (506 mm x 621 mm) | |
| Max Shipping Size | PTH/ VIPPO PTH/Sequential/ 1 level HDI/ Skip via | 19.9”*24.45 (506 mm x 621 mm) | ||
Trace Width/Space
| Parameter | Copper thickness | Normal-MP | Advanced-MP | Limited production | |
|---|---|---|---|---|---|
| Min Trace Width/Space | I/L | ½oz | 3.5/3.5mil | 3/3mil | 2.5/2.5 |
| 1oz | 3.5/3.5mil | 3/3mil | 2.5/3 | ||
| 2oz | 6/6mil | 5/5mil | 4.5/5 | ||
| 3oz | 10/10mil | 8/8mil | |||
| O/L | ½oz + plating | 3.5/3.5mil | 3/3mil | 2.5/3 | |
| ½oz + plating (VIPPO) | 4/4mil | 3.5/3.5mil | 3/3.5 | ||
| 1oz + plating | 6/6mil | 5/5mil | |||
| 2oz + plating | 8/10mil | 6/8mil | |||
Drilling
| Parameter | Normal-MP | Advanced-MP | Limited production | |
|---|---|---|---|---|
| Layer Count | Min FHS (a) | 8mil | 6mil / 4mil | Skip via (10 mil) |
| Min DHS (d)* | 9.8mil | 7.9 mil / 6mil | Skip via (12 mil) | |
| Min Ring (b) | d+10mil | d+8mil | d+6mil | |
| Min AntiPad (c) | d+20mil | d+18mil | d+16mil | |
| Material | Min FHS | 4 | 4 | |
| Min Ring | D+8 | D+6 | ||
| Copper | Min FHS | 10 | ||
| Min Ring | d+10 | |||
| Max Shipping Size | BDHS (e) | d+8mil | d+6mil(CCD) | |
| Stub Length (g) | 7±5mil | 6±4mil | 5±3mil | |
| Accuracy (f) | ±4mil | ±3mil(CCD) | ||
| Back Drill Clearance (h) | d+20mil | d+18mil(CCD) | d+16mil (Vacuum plugging) |
|
Plating Aspect Ratio
| Parameter | Normal-MP | Advanced-MP | Limited production | |
|---|---|---|---|---|
| PTH | Max A/R (Board thickness/ Min finish hole size) | 10.5 (63 mil /6 mil) 12.5 (100 mil / 8 mil) 12.5 (125 mil/10 mil) 10 (260 mil/26 mil) | 10.5 (63 mil /6 mil) 12.5 (100 mil / 8 mil) 12.5 (125 mil/10 mil) 10 (260 mil/26 mil) | 16.7 (100 mil/ 6 mil) 20 (160 mil/ 8 mil) 20 (200 mil/10 mil) 16 (260 mil /16 mil) |
| Micro & Skip Via | 0.75 (3mil/4mil) & (7.5mil/10 mil) | 0.8 (3.2mil/4mil) & (8mil/10 mil) | ||
| Aspect ratio | 16.7 |
|---|---|
| Board thickness | 100mil |
| FHS | 6mil |
| DHS | 7.9mil |
| Aspect ratio | 15 |
|---|---|
| Board thickness | 120mil |
| FHS | 6mil |
| DHS | 7.9mil |
| Aspect ratio | 16.7 |
|---|---|
| Board thickness | 100mil |
| FHS | 6mil |
| DHS | 7.9mil |
Soldermask / Legend
| Parameter | Normal-MP | Advanced-MP | |
|---|---|---|---|
| Soldermask | Color | Green / Blue Red / Yellow / Black | Low DK SM |
| Min. Dam | 3mil / 4mil(Black) | 2.5mil | |
| Min. Clearance | 2mil | 1.5 mil | |
| Min. Coverage | 2.5mil | 2mil | |
| Legend | Color | White / Yellow | Black |
| Min. Width | 5mil | 4mil / 6mil(Black) | |
Surface Finish
| Parameter | Normal-MP | |
|---|---|---|
| Soldermask | OSP | ✓ (In-House) |
| Gold Plating | ✓ (In-House) | |
| ENIG | ✓ | |
| IMAg | ✓ | |
| HASL | ✓ | |
| Selective ENIG | ✓ | |
| IMSn | ✓ | |
| LF HASL | ✓ | |
Tolerance
| Parameter | Normal-MP | Advanced-MP | Limited production | |
|---|---|---|---|---|
| Registration | Core | 2.5mil | 2mil | 1.5mil |
| D2M | 5mil | 4.5mil | 4mil | |
| Tolerance | Impedance | ±10% | Inner layer + 8% Outer layer + 10% | Inner layer + 7% Outer layer + 10% |
| Dimension | Routing：±8mil | Routing：±5mil | ||
| V-Cut：±10mil | ||||
| Thickness | ±10% | ±8% (1.6mm↑) | ||
| PTH | ±3% | ±2mil | ||
| NPTH | ±2% | ±2mil | ||
