Product Information

Process Capability

Summary

ParameterNormal-MPAdvanced-MPLimited production
Layer Count2 - 20 Layers26 Layers34 Layers
Thickness0.6 – 3.5mm0.6 – 3.5mm
MaterialFR-4Mid. Tg/ HiTg/ HFUltra low lossRogers & hybrid material
Min Core4mil3mil2.5mil
CopperInternal½oz, 1oz, 2oz3oz4oz
External½oz, 1oz2oz3oz
Max Shipping Size19.5”*22.5”
(495 mm x 571 mm)
19.9” x 23.5”
(506 mm x 598 mm)
19.9”*24.45 
(506 mm x 621 mm)
Max Shipping SizePTH/ VIPPO PTH/Sequential/
1 level HDI/ Skip via
19.9”*24.45 
(506 mm x 621 mm)

Trace Width/Space

ParameterCopper
thickness
Normal-MPAdvanced-MPLimited production
Min Trace
Width/Space
I/L½oz3.5/3.5mil3/3mil2.5/2.5
1oz3.5/3.5mil3/3mil2.5/3
2oz6/6mil5/5mil4.5/5
3oz10/10mil8/8mil
O/L½oz + plating3.5/3.5mil3/3mil2.5/3
½oz + plating
(VIPPO)
4/4mil3.5/3.5mil3/3.5
1oz + plating6/6mil5/5mil
2oz + plating8/10mil6/8mil

Drilling

ParameterNormal-MPAdvanced-MPLimited production
Layer CountMin FHS (a)8mil6mil / 4milSkip via (10 mil)
Min DHS (d)*9.8mil7.9 mil / 6milSkip via (12 mil)
Min Ring (b)d+10mild+8mild+6mil
Min AntiPad (c)d+20mild+18mild+16mil
MaterialMin FHS44
Min RingD+8D+6
CopperMin FHS10
Min Ringd+10
Max Shipping SizeBDHS (e) d+8mild+6mil(CCD)
Stub Length (g)7±5mil6±4mil5±3mil
Accuracy (f)±4mil±3mil(CCD)
Back Drill Clearance (h)d+20mild+18mil(CCD)d+16mil
(Vacuum plugging)

Plating Aspect Ratio

ParameterNormal-MPAdvanced-MPLimited production
PTHMax A/R
(Board thickness/ Min finish hole size)
10.5 (63 mil /6 mil)
12.5 (100 mil / 8 mil)
12.5 (125 mil/10 mil)
10 (260 mil/26 mil)
10.5 (63 mil /6 mil)
12.5 (100 mil / 8 mil)
12.5 (125 mil/10 mil)
10 (260 mil/26 mil)
16.7 (100 mil/ 6 mil)
20 (160 mil/ 8 mil)
20 (200 mil/10 mil)
16 (260 mil /16 mil)
Micro & Skip Via0.75
(3mil/4mil) &
(7.5mil/10 mil)
0.8
(3.2mil/4mil) &
(8mil/10 mil)
productpic005
Aspect ratio 16.7
Board thickness 100mil
FHS 6mil
DHS 7.9mil
productpic006
Aspect ratio 15
Board thickness 120mil
FHS 6mil
DHS 7.9mil
productpic007
Aspect ratio 16.7
Board thickness 100mil
FHS 6mil
DHS 7.9mil

Soldermask / Legend

ParameterNormal-MPAdvanced-MP
SoldermaskColorGreen / Blue
Red / Yellow / Black
Low DK SM
Min. Dam3mil / 4mil(Black)2.5mil
Min. Clearance2mil1.5 mil
Min. Coverage2.5mil2mil
LegendColorWhite / YellowBlack
Min. Width5mil4mil / 6mil(Black)

Surface Finish

ParameterNormal-MP
SoldermaskOSP✓ (In-House)
Gold Plating✓ (In-House)
ENIG
IMAg
HASL
Selective ENIG
IMSn
LF HASL

Tolerance

ParameterNormal-MPAdvanced-MPLimited production
RegistrationCore2.5mil2mil1.5mil
D2M5mil4.5mil4mil
ToleranceImpedance±10%Inner layer + 8%
Outer layer + 10%
Inner layer + 7%
Outer layer + 10%
DimensionRouting:±8milRouting:±5mil
V-Cut:±10mil
Thickness±10%±8% (1.6mm↑)
PTH±3%±2mil
NPTH±2%±2mil
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